BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//AusschreibungsRadar//Timeline//DE
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:Projekt Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
X-WR-TIMEZONE:Europe/Berlin
BEGIN:VEVENT
UID:b56790234285a89f@ausschreibungsradar.com
DTSTAMP:20260926T002250Z
DTSTART;VALUE=DATE:20260724
DTEND;VALUE=DATE:20260724
SUMMARY:Angebotsfrist — Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
DESCRIPTION:Phase: Ausschreibung | Beschreibung: Angebote werden eingeholt | Link: https://ausschreibungsradar.com/ausschreibung/665210c7-5fa7-480f-b51e-a2dedff0fd0b/
URL:https://ausschreibungsradar.com/ausschreibung/665210c7-5fa7-480f-b51e-a2dedff0fd0b/
END:VEVENT
END:VCALENDAR